Gold Member Since 2015
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Hyfluid Technology (Shanghai) Co., Ltd.

CPU Heatsinks, Aluminium Heat Sink, Heat Sink manufacturer / supplier in China, offering Skive Heat Sink, IGBT Heat Sink, Skived Fin Heatsinks, Skive Heat Sink, Liquid Cold Plate, Copper Pipe Heat Sink and so on.

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Skive Heat Sink, IGBT Heat Sink

FOB Price: Get Latest Price
Min. Order: 50 Pieces
Port: Shanghai, China
Production Capacity: 50kpcs/Month
Payment Terms: L/C, T/T

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Basic Info
  • Model NO.: heat sink
  • Type: Air Cooling
  • Customized: Available
  • Total Height: 135mm Max
  • Thermal Simulation: Available
  • Transport Package: Carton, Standard Export Package
  • Origin: China
  • Application: Heat Dissipation
  • Heatsink Material: Aluminum
  • Fins Width: 600mm Max
  • Finish: Clear Chromate or Anodize
  • Trademark: Hyfluid Technology
  • Specification: RoHS compliance
  • HS Code: 8538900000
Product Description
Skived fin technology has become excellent replacements for designs originally developed using folded / bonded fin technology or high aspect ratio extrusions. These designs are more rugged,have better and more consistent thermal performance, and can be produced with higher production run rates.Below are some favorable features:
1)  No MOQ requirements,no NREC including toolings,fixtures, setup,programming cost,whether prototypes building or mass production.
2)  Skived fin heatsinks is one solid / single piece, no interface thermal resistance,no risk under  impact loads / high temperature / chemical surface treatment after long term running.
3)  The max width of heatsinks profile can reach 5m max, straight fins length along airflow direction can reach 600mm max for Al and 250mm max for Copper.
The max wavy fins length in airflow direction can reach 360mm,the max total height (base thickness + Fins height) would be around 130mm for Al, Friction-stir-welding process would be applied if the fins length is over 500mm.
4)  Fins parameters (fins thickness = 0.05-1.5mm, fins height, pitch = 0.25-7.5mm) may be changed through machine adjustment, not limited / restricted to toolings,easily to gain high aspect ratio and thin fins,gain max area to dissipate heat in a limited volume per thermal simulation results.
5)  To replace folded / bonded fin process by competitive cost,weight reduction,the remarkable improvement to reliability and thermal performance.            
Kindly contact us,we will offer the best customization or alternative solution (apply skived fin process to replace bonded fin process or folded fin process or wide profile extrusion process) for your application by the max cost saving!

Skive Heat Sink, IGBT Heat Sink

Skive Heat Sink, IGBT Heat Sink
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Mr. Harry Zhu
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